All electronics related soldering. Temperature Controlled, Static-Safe, Easily calibratable, cost effective for any requirement
New Equipment | Solder Materials
Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien
New Equipment | Wave Soldering
High temperature, lead-free Soldering Fountain used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards. Microprocessor based digital controller that regulates solder temperature, wave height, and sold
New Equipment | Wave Soldering
High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards. Microprocessor based digital controller that regulates solder temperature
New Equipment | Solder Materials
High temperature composite material for wave solder pallet and reflow soldering pallet
New Equipment | Solder Materials
Kapp Lunar Flux™ is a slurry designed specifically for soldering casted Aluminum, Diecast, Zamak, White Metal and Pot Metal using Alumite™ solder. Residue is electrically conductive and slightly corrosive. Any flux residue should be removed with warm
Sn-Ag-Cu, Sn-Cu, Features; for High Temp Application, Melting Temp. 220-227C, �80-760�m
For soldering to precious metals, thermal fatigue compliant, low temperature step soldering, lead free solutions available.
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New Equipment | Wave Soldering
Features: Easy to control every soldering technical parameter. Digital display of soldering temperature. High reliability: high temperature heating element made the machine performance stable and reliable. Widely used: Can replace brand iron solder
New Equipment | Solder Materials
Lead-free wave and selective soldering systems require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new acti
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