New Equipment | Wave Soldering
V-soltes WS series armed with hot air preheating, nitorgen packaging, dual wave soldering pot and external high power cooling system is proved to be the exact solution to its high process requirement for SMT/AI. - Flux capacity：6L； - Flux runoff：10-
Accurate 16 channel temperature profiling system for use in reflow soldering and wave solder process verification. The equipment offers class leading price,dimensions and performance, RF telemetry and ease of use.For full details visit the 'PROfile
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
High performance composite materials specifically designed for the PCB assembly process Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT r
New Equipment | Rework & Repair Equipment
The Hakko FX-888D is an updated digital version of the popular FX-888 and includes several new features. User selectable preset temperatures and digital calibration simplify user setup and operation, and the new password protection and low temperatur
New Equipment | Rework & Repair Equipment
Features: 1. 862/872 series uses the newest microcomputer processor PID program control technology, the precise digital show air gun and the iron temperature, the power is change bigger, the elevation of temperature is rapid, it won't influence by t
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
Features & Applications: 1 Ideal for wave soldering, insulating circuit board against high temperature 2 Temperature 500��F/260��C 3 Silicone adhesive leaves no residue 4 Sizes between 3mm to 500mm are available upon request
Reflow hot plate used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable,
New Equipment | Solder Materials
95% Tin / 5% Antimony a.k.a. "Antimonial Tin" is a Lead solder replacement for soldering electrical equipment, Copper tubing, and cooling coils for refrigerators. Joints are of moderate strength where the higher strength and higher cost of KappZapp™
