Fine Line Stencil's unique Slic Blade™ process uses electroformed nickel to form a hard, very smooth surface with extremely low surface energy (high lubricity). Solder paste readily sticks to most metal surfaces, even coated blades, due to metal's hi
New Equipment | Solder Materials
FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h
Tape KD851/852 is a polyimide film-backed silicone adhesive tape with high temperature resistant. Application Mask for printed circuit boards during wave solder or solder dip process. Features：KD851 Total Tape T
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
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