New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
130kV, 5 Micron Microfocus X-Ray Inspection System The X-SCOPE 6000 is digitally full programmable CNC controlled x-ray inspection system that allows operators to program inspection and measurement routines with point and click ease. Standard featu
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli
