New SMT Equipment: solderability test hal (Page 5 of 30)

8 Layer Mobile PCB

8 Layer Mobile PCB

New Equipment | Components

Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder

Headpcb

2 Layer CEM-3 pcb

2 Layer CEM-3 pcb

New Equipment | Components

Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F

Headpcb

Dip and Look Systems - Pulsar Solderability System

Dip and Look Systems - Pulsar Solderability System

New Equipment | Test Equipment

“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations.  After the dip process, the operator inspects the terminatio

Hentec Industries, Inc. (RPS Automation)

Test Sockets

New Equipment |  

Our sockets are available in a variety of termination styles including wire wrap, round pin, solder cup, wire crimp and a 1mm diameter round tail for plug connectors.

QA Technology Company, Inc.

SMT 256EP Solder Joint Encapsulant Paste

SMT 256EP Solder Joint Encapsulant Paste

New Equipment | Materials

SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and

YINCAE Advanced Materials, LLC.

Auto-SIR  Surface Insulation Resistance Test

Auto-SIR Surface Insulation Resistance Test

New Equipment | Test Equipment

Auto-SIR – Performs Surface Insulation Resistance testing in accordance with all major international standards: IEC 61189-5, ISO 9455-17, IPC-TM-650, BELCORE GR-78-CORE, DIN German & JIS Japanese standards.  Includes elements of ANSI/IPC-JSTD001C (as

Ascentech LLC

Services

Services

New Equipment | Assembly Services

- Single and double sided SMT (surface mount technology) loading. - Through-hole component loading. - Wave Soldering. - Hand Soldering. - Conformal Coating. - Prototype assembly for new designs. - Final Assembly. - Modifications to exis

Invision Electronic Solutions

EBSO SPA 300/400 NC Automatic Selective Soldering Systems

EBSO SPA 300/400 NC Automatic Selective Soldering Systems

New Equipment | Selective Soldering

The SPA range of systems starts from manual machines all the way up to fully automatic solder centres. The Ebso SPA 300/400 NC is an automatic selective soldering system with manual loading. Solder bath and solder pump is covered with nitrogen. Desi

EBSO GmbH

Wave Solder Optimizer - Wave Shuttle PRO

Wave Solder Optimizer - Wave Shuttle PRO

New Equipment | Wave Soldering

The SolderStar WaveShuttle PRO is a wave optimizer that quickly allows you to analyse, improve and gain control of your wave soldering process. This unique fixture incorporates two measurement systems to give the most comprehensive and repeatable mea

Solderstar

Wave Solder Optimizer

Wave Solder Optimizer

New Equipment | Wave Soldering

Fed up with the high costs of wave solder defects? Companies just like yours have turned to a higher impact, more meaningful approach that directly measures the most critical event in wave soldering -how your boards travel through your solder wave.

Technology Information Corporation


solderability test hal searches for Companies, Equipment, Machines, Suppliers & Information

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