New SMT Equipment: solderability test hal (Page 6 of 15)

MR10 Reflow Ovens

MR10 Reflow Ovens

New Equipment | Reflow

Mechatronika MR10 is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying. Soldering sections are controlled by a microprocessor, that also enables the storage of up to sixteen parametrized temperature

Mechatronika

Lead-free Wave Solder Machine M-400

Lead-free Wave Solder Machine M-400

New Equipment | Wave Soldering

M-400  wave solder machine is designed for middle production thru-hole soldering!  A new streamline design replaces a conventional right-angled exterior. And the design is based on mechanical aesthetics and practicability, making the maintenance an

1 CLICK SMT TECHNOLOGY CO., Limited

PCB Assembly Production

PCB Assembly Production

New Equipment | Assembly Services

At the stage where production PCB assembly is being planned, many other factors come into play, particularly Design-for-Test (DFT) and Design-for-Manufacturability (DFM) issues, making sure documentation is current, planning diagnostics tests and mac

Technotronix

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

OptiCon THT-Line

OptiCon THT-Line

New Equipment | Inspection

The OptiCon THT-Line AOI system provides a parallel inspection of THT components and THT solder joints. In a typical THT production line,  it is possible to inspect mounted components before the soldering processes as well as PCB solder joints during

GOEPEL Electronic

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

Process Capabilities (Lead & RoHS

Process Capabilities (Lead & RoHS

New Equipment |  

Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu

Silicon Forest Electronics

Repair and Rework Services

New Equipment | Rework & Repair Services

Test Medics will analyze and repair customer's printed circuit board assembly products, program firmware on to components, repair boards by changing components and soldering new ones on to the boards, and retesting them to make sure that they are fun

Test Medics, Inc.

Cable Assemblies

Cable Assemblies

New Equipment | Assembly Services

Epec Engineered Technologies manufactures custom cables for specific applications based upon customer design and print requirements. We can assist with cable and connector selection, layout and manufacturing techniques, and computer aided design (CAD

Epec Engineered Technologies

TW3 benchtop wave solder machine

TW3 benchtop wave solder machine

New Equipment | Wave Soldering

TW3 is the best benchtop wave solder machine with the most cost-efficiency, but it is functional over your expection, fully like the full-size wave solder machine, Please see details below: 1). It can run either leaded or lead-free process, its enti

Tripper Technology Limited


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