The LaserVision Mini SP3D system combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of the SMT stencil printing process. With its Windows® 7+ Pro OS and service free USB interface, the Mini SP3D system is e
Automated Benchtop 3D Measurement & Analysis. VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
New Equipment | Cable & Wire Harness Equipment
Overview Microscope for visual analysis of cross-sectional images of crimped connections. Precise results in real-time Simple connection and installation with standard PC Clear illumination with LED ring light Analysis according to
The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS. Packaged in a rugged, bench top platform designed for show, engineered for the most advanced measurement requirements found withi
i-DR A252 configured with the most complete, and advanced features among the series to support today’s various dispensing markets and applications. This series with NDisp3WIN software is ideally for high volume production applications that need
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new ge
Extremely reliable, proven inspection for wave, reflow, pre-reflow and selective soldering. The S3088 flex AOI system was developed for reliable, economical defect detection and fast process optimization. From prototypes to large volume, this flexib
Inspect objects dynamically in 360 degrees with patented Hirox design Superior BGA inspection capable of up to 200x magnification. Low maintenance costs achieved with use of spring loaded lens tip to protect samples. Highly configurable and flexibl
New Equipment | Rework & Repair Equipment
Optimized Rework Process for Large PCB. Unlike other large board systems that are adapted versions of standard systems, the Summit LXi platform is the only rework system designed from the ground up to rework large boards. The LXi’s new enhanced cont
