ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
New Equipment | Solder Paste Stencils
SMT Foil Stencils are laser cut solder paste stencils designed to work on their own for hand printing or with stencil tensioning systems. These laser cut stencils do not need to be permanently glued in a frame. These so-called frameless stencils are
New Equipment | Assembly Services
10-Layer Via-in-Pad Technology PCB features blind via in L9-10 in addition to the Fine Pitch BGA. Putting the via in the pad creates space on the external layers for more routing and avoids potential shorts during assembly. The routing channel widt
Extremely reliable, proven inspection for wave, reflow, pre-reflow and selective soldering. The S3088 flex AOI system was developed for reliable, economical defect detection and fast process optimization. From prototypes to large volume, this flexib
Model:FUJI IP – 3 5000 w/MTU-4R Date of manufacturing: June, 1995 Hours Run:: 30,884 Hours SPECIAL REMARKS:: With right side MTU installed, With Vision Monitor, Reject Part conveyor installed. Machine Software Version: V2.52 Machine Vision Sof
New Equipment | Solder Paste Stencils
Through the increase of mixed technologies, stepped stencils have gained importance to the electronic assembly manufacturer. If the solder paste quantity can no longer be adequately regulated by adjusting Step/Relief Stencil Picture the pad sizes, st
At Present the company is concentrating to meet Quick turn around/prototype and a Pilot Order requirement of :- Double Sided Pth & Multilayer upto 12 layers Printed Circuit Bare Board Material FR � 4 ( Nema � Grade ) with board thickness as per cus
F130AI: Featuring the "Planet Head" - the world's most compact and unique rotary head, the F-series mounter offers great precision by controlling the planet gears with a fully closed rotary servo. Bi-directional head rotation supports the optimal h
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
New Equipment | Solder Paste Stencils
EasyBraid’s stencil rolls are designed for use in SMT screen printing lines which keep stencil apertures clear of paste residues during the automatic screen printing process. They also clean the bottom of stencils, keeping them free from paste and fl
