New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
New Equipment | Coating Equipment
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
New Equipment | Rework & Repair Equipment
Use this quality tool to remove oxides, scale, grease and dirt from leads. The tinned copper braided shielding, backed by a stainless steel spring, ensures a fast and easy job. The lead cleaner meets NASA specification NP-200-4 and ensures the best w
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Product Name: high temperature loading rack Storage data: 50pcs Specification: 355 * (50-250) mm Product specification: l: 355mm * W: 320mm * H: 563mm
New Equipment | Board Handling - Storage
Solder paste printing range (1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes; (2) , IC: support SOP, T
Model name: NPM-W Substrate size Monorail * 1 Overall installation: L50mm×W50mm ~ L750mm×W550mm 2 positions: L50mm×W50mm ~ L350mm×W550mm Dual-track * 1 Monorail transmission: L50mm×W50mm ~ L750mm×
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Sector Specification(CM202-DS) Specification(CM201-DS) ModelNo. KXF-E24C KXF-E14C TactTime 0.088sec/chip 0.176sec/chip B'd change: 3.0 sec Centering method: Upward Vision PCB Size(L x
