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Discover the Industry's Highest Performing True3D SPI Solutions FIND OUT WHY SO MANY MANUFACTURERS IN NORTH AND SOUTH AMERICA RELY ON KOH YOUNG SPI SOLUTIONS Did you know a majority of printed circuit board (PCB) defects occur during solder printin
The Omron Q-upNavi Software system is the absolute solution to total quality control and overall manufacturing process improvement. Q-upNavi represents a revolutionary step forward, tying together data from every step of the inspection process. It pr
ScanINSPECT SPI provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT SPI uses a simple Windows user interface integrated with an automatic conveyo
MVP’s enhanced Ultra SPI Solder Paste Inspection systems deploy our patented 3D technologies along with MVPs trusted AOI capabilities. Utilizing MVP’s patented technology, 3D Solder Paste Inspection (SPI) can be performed on paste for apertures as sm
SIGMA Link is a powerful web-based software suite currently structured around 3 modules: SIGMA Import | SIGMA Review | SIGMA Analysis SIGMA Link is a continuous yield improvement tool to translate SPI and AOI inspection data into useful process inf
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection cap
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection cap
The LineMaster Fusion is a revolutionary platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image and algorithm based AOI sensor technology into a dual purpose, single source solution. Key Features & B
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