Overview The DSPI is a fully configurable SPI master/slave device, which allows user to configure polarity and phase of serial clock signal SCK. It allows the microcontroller to communicate with serial peripheral devices. It is also capable of inte
Overview The DSPI_FIFO is a fully configurable SPI master/slave device, which allows user to configure polarity and phase of serial clock signal SCK. It allows the microcontroller to communicate with serial peripheral devices. It is also capable of
Managing the Ultimate Reflow Oven Output. The KIC RPI helps manage reflow ovens to consistently maximize the desired results. In addition, the RPI provides process deficiency information in order to help users correct their defect issues quickly. T
The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde
Overview The DSPIS is a fully configurable SPI ma slave device, designated to operate with passive devices like memories, LCD drivers etc. The DSPIS allows user to configure polarity and phase of serial clock signal SCK. A serial clock line (SCK) s
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new ge
Item No.: SAC0156 Spec.: It make grid side of PVC curtain have better ESD function to print black conductive ink on ESD transparent PVC film. ● Grid side surface resistance: 104-6ω ● Outside surface resistance: 108-9ω ● Decay time: +V: 0.30S/-V
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
