New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde
108038 JSNA11A-1C CONTROL TEMPERATURE 20' CAP 96616 JSNA11B-1C CONTROL TEMPERATURE 20' CAP 166053 JSNA19AAC-9C DIFFERENTIAL FIXED 100/240 5F 207381 JSNA19ABA-40C CONTROL TEMP REM BULB 104566 JSNA19ABC-24C THERMOSTAT REMOTE BULB 98260
| 1 |
