1. High precision quantification supplier liquid system.. Dispensing tolerance accuracy is 0.0001ml 2. CCD image magnification listing, "+"target precision piston programming can ensure that Dispensing positional accuracy. 3. Japan imports se
New Equipment | Assembly Services
The MCPCB commonly consists of a metal core layer (typically aluminum or copper), a continuous dielectric layer and a copper circuit layer. Protecting electronic components by removing heat, metal base boards feature a thermally conductive dielectri
New Equipment | Test Equipment
The REVETEST® Scratch Testing instrument has become the industry standard for measuring hard-coated materials, with a typical coating thickness of several microns. Coatings may be organic or inorganic, covering Tribological, magnetic and decorative
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
New Equipment | Solder Materials
Kapp Lunar Flux™ is a white paste for the high temperature soldering of Aluminum and Zinc die cast alloy. It is a reaction-type flux with 70% active ingredients dispersed in alcohol. Kapp Lunar Flux™ has considerable shelf life stability, as the susp
New Equipment | Test Equipment
The 33120A function generator has a proven legacy, 15 MHz bandwidth, arbitrary waveforms & modulation capability. DDS technology provides precise adjustment and frequency stability. 15 MHz sine & square waveforms Ramp, triangle, noise & DC
Lead forming machine will trim a wide range of components. It not only routinely accepts various types of caps - TO-92s, LEDs, SIPs etc. - but in the machine's manual mode will easily form and trim leads on components that are too top heavy for other
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
New Equipment | Cleaning Equipment
Digicom Electronics’ Diamond Track Cleaning Process, winner of the 2012 Global Technology Award, is a highly efficient, in-line cleaning system aimed at mitigating failures caused by contaminated PCBs. Our innovative Diamond Track Cleaning Process use
