New Equipment | Board Handling - Conveyors
product instruction ※ Stable and reliable integrated control system ※ Easy to operate touch LED buttons or touch screen control interface ※Machine always fault monitoring ※ optional pass working mode ※ Smooth and parallel width adjustment (
New Equipment | Board Handling - Conveyors
product instruction ※ Stable and reliable integrated control system ※ Easy to operate touch LED buttons or touch screen control interface ※Machine always fault monitoring ※ optional pass working mode ※ Smooth and parallel width adjustment (
New Equipment | Board Handling - Storage
The F9051 PCB Transport Cart has 3 shelves of card guides. Each level can hold fifty 11" long PCBs. The card guides are made of conductive material fo safe and convenient handling of PCBs during assembly. Additional shelves cand be added. Center to c
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Fabrication Services
Choosing the appropriate material for your printed circuit board is a crucial decision that will impact its suitability for specific applications. Through this blog post, we aim to enhance your understanding of Rogers PCBs. If you require further inf
Ersa HOTFLOW 3/20e SMT Reflow Oven Working width: 45-516 mm Process length: 4,840 mm Heated length: 3,725 mm Cooling length: 1,115 mm Weight appr. 1,900 kg Dimension: 6,265x1,201x1,375 mm Ersa HOTFLOW 3/20e SMT Reflow Oven Ersa HOTFLOW 3/20e S
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Ersa HOTFLOW 4/8 Reflow Oven Working width: 45-560 mm Process Length: 3,260 mm Length Heated: 1,525 mm Length Cooled: 1,735 mm Weight app. 1,100 kg Dimension: 3,905x1,410x1,350 mm Ersa HOTFLOW 4/8 Reflow Oven Ersa HOTFLOW 4/8 Reflow Oven High
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
