New Equipment | Cleaning Equipment
Stencil Wiping Rolls are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. We manufactur
VectorGuard is a patented frameless stencil tensioning system offering significant advantages over conventional stencil technologies. Taking all the benefits of frame-mounted stencil systems, VectorGuard improves upon them and delivers a solution cap
New Equipment | Cleaning Equipment
100% Closed-loop Filtration (ECF) System EnviroGuard™ is the first and only aqueous stencil cleaner able to clean all types of solder paste with a 100% closed-loop process - wash and rinse! Smart Sonic matched the unique properties of its 440-R® SM
Cost effective automated stencil printer compatible with standard frames covering a 16" X 18" (406mm x 457mm) print area with power sweep squeegee. Automate Stencil Printing using the SPR-45 with power sweep squeegee and power frame lift for higher
New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
The SP700avi stencil printer combines Speedprints commitment to high performance and reliability with outstanding value. The system has been designed to cope with the rigors of high volume SMT production whilst incorporating the flexibility needed in
The Fritsch Series precision manual and semi-automatic screen/stencil printers combine optimum print quality with outstanding performance and value. They are engineered to provide superior print results with simple, straight-forward operation. The r
The innovative and unique Hyperclean® PX3800 SMT stencil wiper roll gives you a unique combination of zero lint, ESD safe and high performance cleaning. Hyperclean® has been designed using advanced materials and manufacturing technologies to provide
ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
