The SP-1 is an in-line 100% 2D and sampled 3D solder paste inspection system designed for SMT manufacturers. The SP-1 provides highly accurate and repeatable measurements of stencil offset and skew, as well as solder paste area, height and volume.
Technical Innovation The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition) 4 times higher height measurement resolution than the existing Moire technology (The best
Model name :HP-520SPI Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various PCB Clamping options depend on PCB t
(AutoTronik) BS1400 is a very accurate automatic SMT stencil printer. With the powerful AT-align automatic fiducial finding and PCB board offset adjustment system, you can just press the start key, the PCB alignment and printing process will be fully
A Revolutionary Print Solution with Integrated Post Print AOI The VERSAPRINT series not only handles the automatic cleaning of the underside of the stencil and inspection of the printing result, with a choice of 2D or 3D inspection, it also carries
Stand alone Semi-Automatic Stencil Printers with optional Accu-Lign Series Vision Alignment featuring " Train on Paste " capability to make set up a snap. Also available Programmable Squeegees and Under Stencil Wiper Module. 4 Available Vision L
ProDEK is an innovative and high performance closed loop system tool designed to ensure optimisation of the printing performance. Communicating between the DEK screen printer and solder paste inspection machine to identify any potential problems, Pro
The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde
| 1 |
winsouce.jpg)