New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Product Desciption: Stencil clean roll for use in Stencil printers automatic 'under stencil cleaner' is made of the lint free, non woven, fabric. It has a high level of absorbancy and at the same time an open structure to allow for efficient vacuum w
New Equipment | Solder Paste Stencils
Laser Cut Stencils: Industry trend toward miniaturization is leading to finer pitch requirements, high tolerances, and greater repeatability. Our state-of-the-art laser technology enables our customers to experience positional accuracy unattainable w
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil with etched areas. When huge open spaces have to be produced on the bottom side of a stencil, the etching technology is one opportunity to realize it. The apertures for the solder paste print process are still manuf
New Equipment | Solder Paste Stencils
PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope
New Equipment | Solder Paste Stencils
LaserJob has been manufacturing laser cut SMD stencils for last 20 years. In strained condition with a cutting opening of 20µm an aperture size accuracy of ±3µm and an aperture positioning accuracy of ±10µm is guaranteed for SMD - stencils. All laser
The PrinTEK I Model APS gives you exceptional fine pitch accuracy along with an open design for easy stencil loading and alignment. A precision R-Theta tooling plate is manually loaded and unloaded during the print cycle, and the squeegee stroke and
Sunshine manufactures the most advanced stencils powered by LPKF's laser Technology. By combining our experience with the newest technology, we produce unrivaled results Laser stencil specifications: Resolution 0.5 mm Axial Precision �4μm
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil for solder paste printing on wafer. Wafer bumping stencils are characterized by a high number of apertures which lie close together in the size of 90µm x 110µm. A package density of up to 250000 openings is not unus
Our Company Eightronics Plus Sdn.Bhd located in Penang,Malaysia are both manufacturers and suppliers of euipment and cosumables for the SMT Industry. Products: 1.Semi Auto Printers-(Manufacturer) 2.Temperature and Humidity Control Modules for SMT Pr
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