� Two camera, automatic vision servo PCB correction � Right is Right, right side shuttle load position � Unsurpassed vibration squeegee printing technology � Bottom side ultrasonic stencil cleaner � Vibrating squeegee assembly The SemiTouch STAV prin
New Equipment | Coating Equipment
The Orion PECVD system produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels. The system meets all safety, facility and process requirem
New Equipment | Coating Equipment
The Minilock-Orion is a Plasma Enhanced Chemical Vapor Deposition System (PECVD) with a vacuum loadlock that produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at
New Equipment | Test Equipment
Synthesized Swept-Signal Generator, 0.01 - 20 GHz The Agilent 83620B synthesized sweeper for applications requiring the high performance and accuracy of a synthesized source and the speed and versatility of a sweep oscillator. Synthesized broadband
New Equipment | Test Equipment
15 variations of FSK, MSK, PSK, and QAM), AM, FM, phase modulation, pulse modulation, and step/list sweep (frequency and power) E443xB Signal Studio software personalities (Bluetooth, 1xEV-DO) E443xB firmware personalities (3GPP W-CDMA, cdm
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
