Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
New Equipment | Rework & Repair Equipment
Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Rework & Repair Equipment
The PDR E3S SMD Rework Station offers dual closed loop feedback for advanced BGA Repair, QFN Repair, Flip Chip Repair, DFN repair, QFP's, SOIC's and more, and is is engineered with only the finest materials and components for optimum precision and r
New Equipment | Rework & Repair Equipment
PDR E3M Rework System for Micro SMD Rework is made of only the finest materials and components for Micro- BGA Rework, 0201 Rework, CSP Rework, uBGA Rework, LED Rework, area Array Rework, and similar micro applications. Combining PDR's ThermoActive s
New Equipment | Rework & Repair Equipment
The PDR E3G Evolution - Next Generation Rework System - is made of only the finest materials and components for optimum precision and rework excellence. Combining PDR's ThermoActive software technology with PDR's patented Focused - Visible IR Techno
| 1 |
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
