Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)
New Equipment | Fabrication Services
XPCB Limited is one of the leading flexible PCB suppliers in China. We fabricate and assemble the most complex flexible circuit boards for harsh applications, including Oil&Gas, Medical, Security, and Aircraft & Satellite. Layer supported: 1-12 laye
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
Count On Tools specializes in custom engineered nozzles for all types of LEDs (Cree, Luxeon, Phillips, NIchia, Osram, etc). Recent growth in LED technology and solid state lighting has provided the electronics manufacturing industry with viable sol
Substrate To Mask, Mask to Mask, Substrate To Substrate Interchangeable Vacuum Mask Holders Up to 17" Interchangeable Vacuum Chucks For Substrates Up To 16" Square, .3" Thick. Fixed Level And Planarizing Configurations, Fixed Or Removable Substrate
Multilayer Circuit- MHD provides simple single layer circuits to complex high density, thru-hole multilayer circuits. MHD's Thick Film Substrates are used in various applications: Microwave, Medical, Military, Aerospace, Automotive and Commercial.
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
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