New Equipment | Board Handling - Conveyors
Model No: KSUN 250 Automatic Sucking Loader PCB loading time: Approx 6seconds Magazine change-over time: Approx 30 seconds Power supply: 100-230V AC (customized ), single phase, MAX 300V/A Air pressure: 4-6 bar, MAX 30L/minute Transport height:
New Equipment | Board Handling - Conveyors
Model No: KSUN 460 Automatic Sucking Loader PCB loading time: Approx 6seconds Magazine change-over time: Approx 30 seconds Power supply: 100-230V AC (customized ), single phase, MAX 300V/A Air pressure: 4-6 bar, MAX 30L/minute Transport height:
The anti-wobble tool is designed for enhanced functionality when handling INTEL LGA CPU products. This tool improves placment accuracy when picking processor chips from a shipping tray and placing into precision sockets. This BULB-VAC features an ant
PIAB�s range of suction cups is among the widest in the market and covers most applications.
Our most powerful self contained vacuum tweezer designed to handle residue sensitive items such as lenses or optical filters. The plunger in the rear of the tool activates the vacuum, simply push the vacuum plunger, place the soft suction cup to the
HANDI-VAC KIT, Static dissipative, with conductive silicone vacuum cups. (1) 1/8" and (1) 1/4" vacuum cups on bent probes and (1) 1/8" and (1) 3/8" vacuum cups on straight probes. Our HANDI-VAC kits are a low cost pick-and-place tool that can go in
TP39V Split-Vision SMT Placement Product Description Product Description: TP39V aluminum tube making machine/led chip mounter/smd smt pick and place machine Disc feeder can place 24 kinds of component, belt type can place 15 kind of
Passive SMD Magnetic Buzzer ab epoxy potting machine Product Description 2 component polyurethane injection resin machine dispensing machine for pu compound Where to buy PU , epoxy bonding machine ? We Daheng Automation specialize in different ty
Full automatic model with 3 axis bi-component potting compound dosing and dispensing machine PGB-700 system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,sealing, encapsulation and syri
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