New Equipment | Cable & Wire Harness Equipment
Clip on pipe NTC thermistor sensor description The steel clip provides a dual function by holding the sensor housing rigidly in place on a straight section of copper tubing while also providing an excellent thermal connection from the copper tube to
New Equipment | Solder Materials
Economical solder for repairing & joining most metals including Aluminum and cast Iron. Has been the standard for cast Iron and galvanized surface repair for over 60 years. Low application temperatures prevent loss of properties and minimize distor
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system,
The low-cost plasma handset for flexible and versatile use. Use in workshops, laboratories or during repair operations in the field. Extremely easy to operate using the plug & play principle.
ESD Cardboard box made by ESD Corrugated Plastic Sheet. ESD type surface resistance: 10 7 ~ 10 10 ohm Conductive Type surface resistance:10 3ohm~ 10 6 ohm Material is light, Durable easy to process at any style,can be manufatured according to differe
New Equipment | Board Handling - Pallets,Carriers,Fixtures
NPI design and manufacture print, place, reflow carriers. Pallets are cut from standard glass composite (blue) or anti-static material (black). Designs can be constructed from sample card or Gerber / cad data.
Photochromic Polarized Lens This new item is developed based on our polycarbonate polarized lens technology. Our photochromic dye is spread in the polycarbonate layer, not coated on the surface of the lenses. It means the photochromic function wi
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New Equipment | Cleaning Equipment
All kinds of printing or adhesive substrate before the surface activation, modification, grafting, roughening or cleaning. Application: ．LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic c
