New Equipment | Coating Materials
AccuSpec Electronic Services has the capability of producing both low and high volumes of potting assemblies ranging from the simplest of coating tasks to the most difficult potting needs. A variety of potting materials and conformal coatings are ava
New Equipment | Solder Materials
Paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types
For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resistance. Interfacial resistance is a signifi
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
The TS5000DMP positive displacement valve availoable from Keltech Ltd offers advances in the controlled application of pastes, adhesives and assembly fluids. More accurate than standard time/pressure valves, the TS5000DMP uses a disposable fluid fee
The TS5000DMP positive displacement valve availoable from Keltech Ltd offers advances in the controlled application of pastes, adhesives and assembly fluids. More accurate than standard time/pressure valves, the TS5000DMP uses a disposable fluid fee
High speed, precision dispensing by digital and cam drives. High speed, precision dispensing: 0.08 sec./dot saves floor space due to compact design. Glue is charged with compressed air at a high speed and the advanced cam-link head mechanism is abl
Two types of linear assembly are available – Carousel and Over and Under. Complimenting the modular Project Daytona system these are pallet indexing systems especially suited for high volume production. Technical Info: Output speeds up to 1000ppm
New Equipment | Solder Materials
8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
