170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
AAMA3535 ANALOG ALARM DIN RAIL MODULE AAMR6436 APOLLO ACCESSORIES ACA10000 ACE10000 ACE20000 ACE30000 ACE40000 ADI INTELLIGENT MESSAGE DISPLAYS ADI2R11A ADI2R11D ADI4T11A ADI4T11D ADI4Y11A ADI4Y11D SIGNAL CONDITIONING DIN RAIL MODULES
New Equipment | Industrial Automation
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