2.0 Cpk @ +/- 12.5µm, (±6 Sigma) * Process Alignment Capability >2.0 Cpk @ +/- 25µm, (±6 Sigma) * Standard cycle time 10 seconds + process Maximum printing surface 508 mm (X) × 508 mm (Y) User interface Touchscreen, keyboard a
The FKN Systek K4000 motorized linear blade depanelizer is designed for high volume singulation of scored and skip scored Printed Circuit Boards. No programming necessary. (Switch select operating mode and speed) Singulate panels with components
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
DEK NeoHorizon 03ix SMT Stencil Printer Standard cycle time： 8 seconds + processMaximum printing surface： 510 mm (X) × 508,5 mm (Y)Weight: Approx. 690 kgDEK HawkEye 750 digital cameraProduct description: DEK NeoHorizon SMT Stencil Printer, Standard
DEK NeoHorizon 01ix SMT Stencil Printer Standard cycle time: 6.5 seconds + processMaximum printing surface: 510 mm (X) × 508,5 mm (Y)Weight: Approx. 690 kgDEK HawkEye 1700 digital cameraProduct description: DEK NeoHorizon SMT Stencil Printer, Standa
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Toddco3 Hotbar Bonding or Soldering System is a modular, floor standing bonder with a precision servo-driven rotary table. Compact overhead controls system with touch-screen display for easy operator acess is standard. Standard system software provid
The eP33/eP35 employs a number of unique features to provide fast and accurate deposition of solder paste within +/- 12 microns, namely: A heavy-duty, mono-block casting, enabling optimal mechanical rigidity. A precision, two-stage servo-driven gran
New Equipment | Selective Soldering
ECOSEL - 300 is a table top compact offline selective soldering machine. Solder pot and flux sprayer are fixed, the PCB is articulated with a X/Y stepper motor, Z with an air cylinder, inline N2 heating system, and the nozzle travel path can be progr
New Equipment | Soldering - Other
The TG-500 Hotbar Bonding System is a bench-top, pulsed-heat, hotbar soldering system with modular options that accommodate a broad range of process requirements. TG-500's standard feature list includes high level process development features, precis
