Outstanding heating capacity by the existing hot air circulation system that has been proven excellent by its actual achievements. Enhanced maintenanceability by loading the flux collection unit. PC-controlled high operationabilty Various ser
Adjustable air blow speed Heater Temp ≅ Blow Air Temp Profile Temp ≅ Setting Temp Best At performance in its class Lowest run cost in its class Windows XP software operation Lead-free reflow HAT profile optimization High v
THE HOTFLOW SERIES: INDIVIDUALLY TAILORED TO YOUR NEEDS. Outstanding thermal performance, highest machine uptime and lowest operating costs have been the convincing advantages of Ersa reflow soldering systems for many years already. The HOTFLOW 3
Lead Free 4 Top 4 Bottom plus 1 cooling zone Vintage: 2003 Specs: Substrate size(min/max): L100xW25mm/ L250xW75mm Substrate Height : 10mm max (upper) Transfer method : wire belt conveyor method Transfer height : 900 A+/- 20
JRE, Inc. is a provider of Contract Electronic Assembly Manufacturing Services. Quick turn as well as volume production capabilities for SMT, Fine Pitch placements, BGA and micro BGA, Thru- hole, Hybrid, RF, complete turn-key and box builds. Servic
| 1 |
winsouce.jpg)