8-layer PCB with impedance control. Surface Finish: Immersion Gold
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
New Equipment | Assembly Services
100% manufacturability check prior to production IPC Class 2 specifications 100% electrical test on all boards Fully-finished PCBs with 2 solder-masks and 1 or 2 silk-screens Full finish on copper: HASL, RoHs, gold or silver . 1
1) 4 layers board, 1.2mm thickness 2) Min. track width: 0.13mm 3) Min. track space: 0.12mm 4) Min. hole size: 0.3mm 5) Finish: immersion gold
Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold
Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold
1) Single Sided PCB 2) Material ranges: FR-1, 94VO/HB, 22nf, CEM-1 and CEM-3, FR-4 3) Copper weight: 1-2 oz 4) Profile: Punch 5) Thickness: 0.8mm-1.6mm 6) Surface finish: OSP, HASL, Immersion Gold
Materials: FR-4 Copper Thickness: 1 oz Layer Count: 10layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 5 mil Finishing: Immersion Gold
Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4 layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 5 mil Finishing: Immersion Gold
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