Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a
Hanwha DECAN S1 Pick and Place Machine Speed: 47,000 CPH PCB Size : L510xW510 Feeder input:120pcs Weight: 1600KG Product description: Hanwha DECAN S1 Pick and Place Machine, Speed: 47,000 CPH, PCB Size : L510xW510, Feeder input:120pcs, Weight: 1600K
Hanwha HM520 MF Pick and Place Machine The Hanwha HM520 MF series mos are a state-of-the-art high-speed modular with extreme flexibility. · Actual productivity is highest among machines of the same class · Optimized to high quality production · Unma
New Equipment | Coating Equipment
The Select Coat® conformal coating machine provides the highest productivity and quality for your automated coating processes. Automate your conformal coating with state-of-the-art process controls, world-leading know-how, expertise in fluid dynam
Inline High Precision CCD fiducial Visual Dispensing Machine This is an inline dispensing machine, connecting other machines at the front and in the back via a conveyor, and communication signals (e.g. SMEMA). Working as an automatic assembly line,
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
Technical Innovation The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition) 4 times higher height measurement resolution than the existing Moire technology (The best
