New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
10 Zones Economical SMT Reflow Oven KTE-1000 Heating:10 heating zones Cooling zones: top 2 Weigth: APPROX 2615KG Dimension: 6135*1360*1490mm Product description: 10 Zones Economical SMT Reflow Oven KTE-1000, Heating:10 heating zones, Cooling z
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
KIC offers standard sized thermocouples in a variety of temperature ranges and wire lengths to meet virtually any application requirements. Standard Temp, Type K Chromel/Alumel, 260C max temp, multiple colors Medium Temp, Type K Chromel/Alumel, 4
TFCP-003-50 TFCP-003-100 TFCP-003-500 TFCP-005-50 TFCP-005-100 TFCP-005-500 TFCP-010-50 TFCP-010-100 TFCP-010-500 TFCP-015-50 TFCP-015-100 TFCP-015-500 TFCP-020-50 TFCP-020-100
