Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
New Equipment | Soldering Robots
Model: DH-800 Robot Automatic Dispenser product model： DH-800D Dispensing range： 300/300/90 maximum load Y/Z: 10KG/6KG Speed X& Y/Z(mm/sec) 500/500/300 external dimensions ： 465*495*697mm Body weight（KG): 42 capacity of decomposition ：0.01m
New Equipment | Board Handling - Conveyors
Model No: KSUN 460F Cooling Conveyor Power supply: 100-230V AC (customized), single phase Power load: MAX 100V/A Transport direction: Left to right/right to left(optional) Transport height: 900±20mm (or customized) PCB thickness: Min 0.6mm PC
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
New Equipment | Coating Equipment
The Viscosity Control System maintains consistent temperature of conformal coating fluids. The system includes a heated recirculating fluid circuit to eliminate viscosity changes in temperature-responsive materials. Close-range temperature monitoring
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
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