New SMT Equipment: temperature profil (Page 1 of 183)

Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5

Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5

New Equipment | Reflow

Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro

Heller Industries Inc.

Vertical Curing Oven - Heller 788

Vertical Curing Oven - Heller 788

New Equipment | Curing Equipment

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

New Equipment | Reflow

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

HeatShields™ Ceramic Thermal Shielding Material for PCB Rework

HeatShields™ Ceramic Thermal Shielding Material for PCB Rework

New Equipment | Rework & Repair Equipment

Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a

BEST Inc.

Heller 1707 MK7 SMT Reflow Oven

Heller 1707 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1707 MK7 SMT Reflow Oven 7 Heating ZonesMax PCB Width: 56cmWeight: 1450KGDimension: 360x152x144cmProduct description: Heller 1707 MK7 SMT Reflow Oven, 7 Heating Zones, Max PCB Width: 56cm, Weight: 1450KG, Dimension: 360x152x144cm   Heller

Qersa Technology Co.,ltd

Surface Mount Soldering F8

Surface Mount Soldering F8

New Equipment | Reflow

Surface Mount Soldering F8 Surface Mount Soldering Heating zones: 8 Heating method: Hot Air Usage: SMT Assembly line Product description: Surface Mount Soldering, Heating zones: 8, Heating method: Hot Air, Dimension(L*W*H) 5000*1320*1490mm Wei

Flason Electronic Co.,limited

Ersa HOTFLOW 4/14 Reflow Oven

Ersa HOTFLOW 4/14 Reflow Oven

New Equipment | Reflow

Ersa HOTFLOW 4/14 Reflow Oven Working width: 45-560 mmProcess length: 4,400 mmHeated length: 2,665 mmCooling length: 1,735 mmWeight appr. 2,000 kgdimension: 5,030x1,410x1,350 mm   Ersa HOTFLOW 4/14 Reflow Oven Ersa HOTFLOW 4/14 Reflow Oven Refl

Qersa Technology Co.,ltd

ETA A-Series Energy Saving Reflow Ovens

ETA A-Series Energy Saving Reflow Ovens

New Equipment | Reflow

A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co

I.C.T ( Dongguan ICT Technology Co., Ltd. )

slim kic 2000 reflow oven thermal profiler temperature Curve analyzer

slim kic 2000 reflow oven thermal profiler temperature Curve analyzer

New Equipment | Test Equipment

slim kic 2000 reflow oven thermal profiler temperature Curve analyzer Product description: slim kic 2000 reflow oven thermal profiler temperature Curve analyzer  INQUIRY slim kic 2000 reflow oven thermal profiler temperature C

Flason Electronic Co.,limited

slim kic 2000 reflow oven thermal profiler temperature Curve analyzer

slim kic 2000 reflow oven thermal profiler temperature Curve analyzer

New Equipment | Other

slim kic 2000 reflow oven thermal profiler temperature Curve analyzer reflow oven thermal profiler temperature Curve analyzer slim kic 2000 reflow oven thermal profiler Product description: slim kic 2000 reflow oven thermal profiler tem

Flason Electronic Co.,limited

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