New Equipment | Test Equipment
A redesigned website with temperature test and conditioning content for design and manufacturing engineers has been introduced by inTEST Thermal Solutions. The new site delivers information about temperature controlled environments including thermal
The 3500 Lead Free Soldering Station Features Remote Controlled Temperature Programming, Pre-Set Temperature settings can be varied for specific temperatures. The 3500 lead free soldering station also features Auto Tip Temperature compensation, Stan
New Equipment | Solder Materials
Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
Epibond� 7275-Series surface mount adhesives offer excellent performance for all print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non st
Features & Applications: 1 Ideal for wave soldering, insulating circuit board against high temperature 2 Temperature 500��F/260��C 3 Silicone adhesive leaves no residue 4 Sizes between 3mm to 500mm are available upon request
Polyimide masking discs have 1.2~1.5 mil of silicon adhesive which does not leave any residue. It can withstand temperature up to 280℃. Applications: Electrical Insulation, Gold leaf mask of printed circuit boards during wave soldering, transformer
New Equipment | Soldering Robots
The soldering tip of Tsutsumi enables stable temperature control based on the well-balanced design. The durability is improved by thicker plating, the heat is hard to run off. The temperature drop during the soldering becomes smaller, the tip's lon
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
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