Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
DOCTAR is used validate design changes throughout the hardware board design and manufacturing lifecycle. DOCTAR analyzes changes to both to physical and logical elements in the design database. Test point analysis includes test points that have b
DOCTAR is used validate design changes throughout the hardware board design and manufacturing lifecycle. DOCTAR analyzes changes to both to physical and logical elements in the design database. Test point analysis includes test points that have b
200° C) HARDWARE: Fixing pre-assembled with, Sleeve, Carbon Steel Spring & screw. Countersunk screw supplied for attaching fixing to carrier. Classification: Common used length screws is 25mm, 31mm, 35mm, 38mm, 42mm, 44mm(Notes: This screw length is
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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
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