1. FR-4 Tg170 2. 20 layer, 1.6mm thick 3. 1 oz copper finished 4. 10% impedance control 5. Blind/buried vias 6. 0.1mm holes, HDI 7. Application: telecommunication, industrial control, medical equipment
New Equipment | Soldering - Other
The TG-500 Hotbar Bonding System is a bench-top, pulsed-heat, hotbar soldering system with modular options that accommodate a broad range of process requirements. TG-500's standard feature list includes high level process development features, precis
New Equipment | Assembly Services
PNC Inc. has been manufacturing hi-reliability printed circuit boards since 1968. All Military Spec PC boards are manufactured in the security of our Nutley NJ, USA facility. PNC is certified by the Department of Defense to Military Performance Speci
New Equipment | Assembly Services
TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left
Perfectly suited for multi-layer, high aspect ratio, and high-Tg boards. For PCB UC/ST - series Diameter: ø0.20 ~ ø0.55mm PCB UC/ST Series drills are designed for the PCB market and are highly rigid. Diameter (D) Flute
Printed Circuit Board Prototypes. PNC Specializes in Quick Turn Prototype PCBs starting at 24 Hour turn times without sacrificing Quality. We have been the Leader of quick turn for 45 Years using the latest Manufacturing processes and equipment. Ou
High Tg FR4 Material 2.0 mm Thickness 6 Layers Immersion Gold Surface Treatment Green Solder Mask Carbon Ink
6-Layer Tg180 ENIG Board with BGAs
Layer: 12 Material: FR4(Tg170) Board thickness: 1.6mm Min trace width/spacing: 4/4mil Min hole size: 0.2mm Impedance control
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
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