Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
SemiPack's capabilities range from fully automatic to manual processing; extensive cropping and forming capabilities; active and passive component processing; axial to radial lead forming servicing; and snap-in and stand-off forms. For SMT processi
Seamless Delivery to the Marketplace. The smooth flow of our services continues through to assembly. Our vertically integrated services allow customers to implement engineering changes dynamically. Our fully expandable information system provides fo
Up to 3500 pph with fine pitch capabilities starter package includes: 12 tape feeders ,fine pitch squaring station, teach camera and Pentium computer for $19,975.00
Up to 4500 pph with fine pitch capabilities starter package includes: 12 tape feeders ,fine pitch squaring station, teach camera and Pentium computer for $29,975.00
PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
1.Product Introduction The third generation model TM245P is NeoDen Tech’s independent product,with completely independent intellectual property,leading this technology in China. TM245P series is the third generation of Neoden Tech’s desktop pick an
Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
