FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework). SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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