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Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system,
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New Equipment | Cleaning Equipment
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Premo-Flex™ FFC and etched polyimide jumpers, available in a variety of pitches, cable lengths and thicknesses, plus high-temperature ratings up to +105°C, deliver durable, ultra flexible, competitively priced solutions for PCB connections in virtual
Universal GSM2 Pick and Place Machine FlexJet 7 Spindle head Dual 15 Cycle counts FJ = <7 million PrecisionPro Feeder Bases Product description: Universal GSM2 Pick and Place Machine, FlexJet 7 Spindle head, Dual 15" Flat screen moni
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830