Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the followin
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
Shellac is a kind of non-toxic natural gum resin dissolves in a wide variety of alkaline or rapidly drying alcoholic solvents but is resistant to a number of other solvents particularly hydrocarbons. The low thermal conductivity and a small coefficie
The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli
similar Meldin polyimide is available in five standard grades: Meldin 7001 - Unfilled. Maximum strength & elongation: lowest modulus & thermal conductivity: optimum electrical. Meldin 7021 - 15% graphite (by weight). Enhances inherent wear resist
New Equipment | Board Handling - Pallets,Carriers,Fixtures
We take pleasure to introduce ourselves as one of the renowned Exporter, Manufacturer & Supplier of Anti-Static ESD Acrylic PMMA Sheet in Shenzhen, Guangdong, China. Properties Test Method Unit Value Physical Properties Density ASTM D792 g/cm³ 1.19 W
Polyimide a kind of Heteroaromatic polymers, whose Molecular structure containing polyimide-based monomeric unit. It is a super-performancde Engineering Plastic (250 degree heat can be a long-term job), and has an excellent mechnical and thermal dime
280°C). Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C was designed with a dielectric constant of 3.38. The RO4350B has a dielectric constant of 3.48 and is UL94V-0 rated. RO445
EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle
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