New SMT Equipment: thermal pads stencil design (Page 1 of 4)

Thermal Transfer, Thermal Interface Materials

Thermal Transfer, Thermal Interface Materials

New Equipment | Materials

We are well versed in the following thermal application materials:     Sil-Pad thermally conductive insulators     Gap-Pad thermally conductive gap filling material     Q-Pad thermal grease replacement film     Bond-Ply thermally conductive adh

ORION Industries

Step & Relief Stencils

Step & Relief Stencils

New Equipment | Solder Paste Stencils

Through the increase of mixed technologies, stepped stencils have gained importance to the electronic assembly manufacturer. If the solder paste quantity can no longer be adequately regulated by adjusting Step/Relief Stencil Picture the pad sizes, st

Fine Line Stencil, Inc.

SMT Mini Stencils / PCB Rework Stencils

SMT Mini Stencils / PCB Rework Stencils

New Equipment | Solder Paste Stencils

Stentech produces mini stencils; small stencils that are used mainly for BGA re-work. Mini stencils are designed to deposit precise amounts of solder paste for single BGA footprints on loaded PCBs. These precision stencils mimic the footprint and ape

Stentech

PADS® PCB Design Tools

PADS® PCB Design Tools

New Equipment | Software

A complete, but lower-cost PCB design solution for smaller organizations or individuals PADS®, Mentor Graphics’ world-leading desktop PCB design tool, enables you to develop PCBs within a highly productive, scalable, and easy-to-use environment.

Mentor Graphics

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

New Equipment | Materials

EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle

Conductive Compounds, Inc.

TTC100C - Lead Free Tip Tinner

TTC100C - Lead Free Tip Tinner

New Equipment | Solder Materials

Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic

FCT ASSEMBLY, INC.

Laser Cut SMT Stencils with Re-usable ACCUFRAME

Laser Cut SMT Stencils with Re-usable ACCUFRAME

New Equipment | Solder Paste Stencils

PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope

PNC Inc.

BGA Rework Stencils

BGA Rework Stencils

New Equipment | Solder Paste Stencils

BGA Rework Stencils are now available direct to you and may be a major product improvement over what you are may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precis

FCT ASSEMBLY, INC.

EKRA XACT 4 - Compact Screen & Stencil Printer

EKRA XACT 4 - Compact Screen & Stencil Printer

New Equipment | Printing

The XACT 4 automatic screen and stencil printer is specially designed to perform any kind of production demands within the electronic industry, and therefore paying special attention to its universal usage. The XACT 4 features the exceptional EKRA ea

ASYS Group

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

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