New Equipment | Board Handling - Pallets,Carriers,Fixtures
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Full range of thermal process control instruments for thermal profiling.
Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
From plastic sockets to ceramic BGA components, the Chipmaster Rework system provides a controlled environment, which cares for your repair process. Features simple operation with "Timed" process control and selected thermal profiling
Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification. OvenCHECKER™ gr
Painless Profiling for Perfect Oven Recipes When utilizing the AutoM.O.L.E.®Xpert3 System, you are entering a new phase in the thermal management of your automated soldering operations. The new AutoM.O.L.E.®Xpert3 System automatically guides you thr
stores in its memory 4 runs of thermal profiling. The data is viewed instantly on display right at the oven,in a summary table, full range graphs and sizable peak area graphs.Its software allows you to store the data and perform data analysis.
Robust and Compact Hardware with 2 Year Warranty This new and improved hardware is designed to withstand the roughest and toughest daily handling. In addition, the electronic circuitry has been changed to tolerate a higher level of voltage spikes th
