New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Test voltage: 50 to 300V
New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Testing voltage: 50 to 300V Packing: vacuum packing for PCB, and good condition outer boxes
Strain gage testing is utilized to evaluate materials and processes effect on PWB and component-level stress due to static and dynamic loads. These stresses can originate from sources such as thermal, mechanical, and/or a combination of the two. STI
New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20s Test voltage: 50 to 300V Package: vacuum packing for PCB, and good condition outer box; attached strong strap to reinforce outer box
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
As your manufacturing partner, providing an end to end solution, we understand that the quality of our work affects not only our reputation, but, more importantly yours. A complete and thorough offering of testing services ensures that your products
LEN 66A is one part 100% solid, super fast UV curable bonding adhesives, which has been designed for lens attachment, protective cover windows and touch screens. It can also be used for LCD lamination and sealing, polarizer lamination and touch scree
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Press Fit Technology is the process of choice for many electrical engineering applications. Press Fit technology creates mechanically and electrically stable gaslight connections without the need for additional fastenings, soldering or thermal stres
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
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