New SMT Equipment: thermal stress qfn (Page 1 of 8)

HTCC QFN Packages

HTCC QFN Packages

New Equipment | Components

HTCC QFN Packages to 40GHz High Temperature Co-Fired Ceramic (HTCC) QFN packages from Barry Industries feature low-loss broadband transitions for superior performance over frequency. HTCC construction provides for enhanced mechanical strength and h

Barry Industries, Inc.

Strain Gage Test Services

Strain Gage Test Services

New Equipment | Test Services

Strain gage testing is utilized to evaluate materials and processes effect on PWB and component-level stress due to static and dynamic loads. These stresses can originate from sources such as thermal, mechanical, and/or a combination of the two.  STI

STI Electronics

Precision Dicing Blades

Precision Dicing Blades

New Equipment |  

We manufacture and distribute a complete line of resinoid,metal sintered, and nickel bond diamond dicing blades. Resinoid blades: used on Glass, Ceramic, Sapphire and Quartz. Nickel bond: used to cut Silicon and III-V materials. Metal Sintered stress

Dicing Blade Technology

PH 100 Low Profile Infrared PCB Preheater

PH 100 Low Profile Infrared PCB Preheater

New Equipment | Rework & Repair Equipment

Rapid, Safe Soldering or Desoldering on High Mass, Heat-Sinking Assemblies Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's and

PACE Worldwide

Thermally Conductive Adhesives

Thermally Conductive Adhesives

New Equipment | Materials

For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resistance. Interfacial resistance is a signifi

Zymet, Inc

14-layer PCB with 3 Mils Minimum Line Width/Space, Made of FR4 Material

14-layer PCB with 3 Mils Minimum Line Width/Space, Made of FR4 Material

New Equipment | Assembly Services

1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Test voltage: 50 to 300V

Shenzhen Linghangda Electronic Co.,Ltd

High-density multi-layer PCB with 3 Mils Minimum Line Width

High-density multi-layer PCB with 3 Mils Minimum Line Width

New Equipment | Assembly Services

1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Testing voltage: 50 to 300V Packing: vacuum packing for PCB, and good condition outer boxes

Shenzhen Linghangda Electronic Co.,Ltd

E3S Rework Station Designed for BGA Packages  - SMD Rework

E3S Rework Station Designed for BGA Packages - SMD Rework

New Equipment | Rework & Repair Equipment

The PDR E3S SMD Rework Station offers dual closed loop feedback for advanced BGA Repair, QFN Repair, Flip Chip Repair, DFN repair, QFP's, SOIC's and more, and is  is engineered with only the finest materials and components for optimum precision and r

PDR-America

Thermal pads

Thermal pads

New Equipment | Other

M400 Series thermallyconductive interface materials are applied to fill the air gaps between the heatingelements and the heat dissipation fins or the metal base. Their flexibility andelasticity make them suited to the coating of the very uneven surfa

WE GOT Electronic Co., Ltd

DRM-18H Component Identification Training and Reference Guide

DRM-18H Component Identification Training and Reference Guide

New Equipment | Education/Training

The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, c

soldertools.net

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PCB Handling Machine with CE

Software for SMT placement & AOI - Free Download.
IPC Training & Certification - Blackfox

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.