New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
.jpg)
Refurbished NXT-III 2xM3III (2 x H24S Head) FUJI SMT Pick and Place Machine Specification of FUJI AIMEX III SMT SMD Pick and Place Machine MC Model M3 III M6 III Applicable PCB size (LxW) 48 x 48 mm to 250 x 510 mm (dou
We are well versed in the following thermal application materials: Sil-Pad thermally conductive insulators Gap-Pad thermally conductive gap filling material Q-Pad thermal grease replacement film Bond-Ply thermally conductive adh
Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
New Equipment | Design Services
The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced mat
New Equipment | Education/Training
This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more. Students will be introduced to the proper techniques for SMT & PTH compon
New Equipment | Rework & Repair Services
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
New Equipment | Education/Training
The J-STD-001 Space Electronics Hardware Addendum provides additional requirements over those published in IPC J-STD-001 to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic env
High capacity 8 zones Lead-Free dual track Reflow oven from china manufacturer Features: HR Series High End/Nitrogen Reflow Soldering Machine ¤Suitable For High End Products/Critical Process Criteria ¤6, 8, 10, 12 Heating Zones Available ¤S
.png)
