The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli
The unique electrical, thermal and mechanical properties of aluminum combined with Polyonics proven coating, adhesive and manufacturing technologies provide high quality tape material ideal for high temperature applications. In particular, Polyonics
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
The Fire Problem The Flame ProblemThe ever-increasing and widespread use of electronic devices, such as laptops, tablets, personal digital assistants (PDA’s) and smart phones is requiring longer and longer battery life. The batteries become increas
1. HTCC Ceramic Feedthrus 2. High Frequency Design, upto 10Ghz ideal for high speed devices 3. Enhanced thermal conductivity, ideal for TEC installation 4. DWDM, WWDM, WDM, EDFA, tunable laser, EA, SOA, and CW Optical Packages for the industries of
New Equipment | Solder Materials
Features ♦ Large high contrast LCD display, easy to read out ♦ Functions menu allows easy access for setting and control ♦ Temperature adjusted in ±1oC ♦ Silver vortex heating element, great heat conduction ♦ 120W switching power supply, sup
This small reflow oven provides a versatile heating system for lead-free preheating, curing, reflow, rework, and thermal cycling applications in prototype or batch applications. Combination forced air convection/conduction heating system for consiste
Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printin
HTCC QFN Packages to 40GHz High Temperature Co-Fired Ceramic (HTCC) QFN packages from Barry Industries feature low-loss broadband transitions for superior performance over frequency. HTCC construction provides for enhanced mechanical strength and h
1Double-sided LED circuit board Layer count: 2 Material: Chaoshun CCAF-01 aluminium base CCL Board thiness: 1.6MM Copper thiness: 1oz Min. hole size: 0.8mm Thermal conductivity: 1.0W/m-K Breakdown voltage: 4.0KV Application: LED Light
