New Equipment | Tape and Reel Equipment
ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The preform is placed directly into the solder paste prior to assembly reflow. Alpha So
1. HTCC Ceramic Feedthrus 2. High Frequency Design, upto 10Ghz ideal for high speed devices 3. Enhanced thermal conductivity, ideal for TEC installation 4. DWDM, WWDM, WDM, EDFA, tunable laser, EA, SOA, and CW Optical Packages for the industries of
New Equipment | Solder Materials
Features ♦ Large high contrast LCD display, easy to read out ♦ Functions menu allows easy access for setting and control ♦ Temperature adjusted in ±1oC ♦ Silver vortex heating element, great heat conduction ♦ 120W switching power supply, sup
This small reflow oven provides a versatile heating system for lead-free preheating, curing, reflow, rework, and thermal cycling applications in prototype or batch applications. Combination forced air convection/conduction heating system for consiste
Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printin
HTCC QFN Packages to 40GHz High Temperature Co-Fired Ceramic (HTCC) QFN packages from Barry Industries feature low-loss broadband transitions for superior performance over frequency. HTCC construction provides for enhanced mechanical strength and h
1Double-sided LED circuit board Layer count: 2 Material: Chaoshun CCAF-01 aluminium base CCL Board thiness: 1.6MM Copper thiness: 1oz Min. hole size: 0.8mm Thermal conductivity: 1.0W/m-K Breakdown voltage: 4.0KV Application: LED Light
Layer: Single-Sided Price：USD275.50 Quantity :3Panel Min Holes：2.00mm surface Treatment:ENIG solder mask:White silk screen : Black Board Thickness: 1.6mm Cu Thickness: 35um Aluminium Model: 5052 Thermal Conductivity: 150W/m. K Breakdown Voltage:
Layer: Single-Sided Price：USD295.50 Quantity :10pcs Min Holes：2.00mm surface Treatment:ENIG solder mask: Black silk screen :White Board Thickness: 3.0mm Cu Thickness: 70um Thermal Conductivity: 220W/m. K Breakdown Voltage: AC2KV-7KV
DA 90 is a silver filled, high thermal conductive, solvent-free and fast curing thermosetting die attach adhesives. DA 90 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. It can be applied using dis
