Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
Thermodime� diamond heat transfer compound from Electrospell is an ultra high thermal conductivity thermal interface material composed of pure surface-modified diamond microcrystals suspended in a special carrier fluid. The product comes in a 1 ml sy
New Equipment | Cable & Wire Harness Equipment
NTC Thermistors Temperature Sensor Probe Description NTC Thermistor can be assembled in housing in a variety of configurations for temperature sensing, measurement, detection, indicator, monitoring and control. Thermistor temperature sensor probe ass
New Equipment | Assembly Services
The AGS15000 series of Cartesian gantry systems is designed for ultra-precision, high-dynamic contouring, providing outstanding performance and versatility in a wide range of automation platforms. The planar design minimizes dynamic pitch errors at t
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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