JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050Board size:50×50-650×370mmFeeder inputs:max.112placement capacity:47,000 CPHProduct description: JUKI RS-1R Pick and Place Machine, Applicable Components: 0201~5050,Board size:50×50-6
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit
New Equipment | Assembly Services
The AGS15000 series of Cartesian gantry systems is designed for ultra-precision, high-dynamic contouring, providing outstanding performance and versatility in a wide range of automation platforms. The planar design minimizes dynamic pitch errors at t
New Equipment | Assembly Services
Configurable T-style robot up to 1.5 m x 0.5 m x 0.3 m travel Velocities up to 1.4 m/s provide high throughput Integrated Cable Management System (CMS) shortens your machine build 3-axis load up to 25 kg for demanding applications Cus
Inspection of low, medium & high volume surface mount & thru hole technology. AOI Systems ScanSpection uses two basic algorithm groups to inspect component and soldering. The first algorithm checks the component related parameters at once, with the
Otek AOI is an Automatic Optic Inspection Equipment developed and manufactured by the GFirst OEIC Co., Ltd., in Xiamen, China. Given the level of operators and the practical manufacturing environment they work in, the design tenet of Otek AOI is its
New Equipment | Test Equipment
Inline test system for incircuit and functional tests with Teradyne measuring equipment ENGMATEC presented for the first time a test handler with integrated Test Station Inline TSi from Teradyne. On request of the Boston company Teradyne, a test
Where High Mix Meets High Speed. With the MY100e series pick-and-place machines, there’s no need to make the usual trade-offs between speed and flexibility. With the fastest changeovers in the industry and workcell solutions reaching speeds of up t
New Equipment | Rework & Repair Equipment
Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in
Inspection and Data Creation Tool for the Stencil / Screen Fabrication Industry. World's leading solder paste stencil & emulsion screen inspection system. Used by both stencil/screen fabricators and users to detect errors BEFORE production, elimina
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