New SMT Equipment: thick solder paste (Page 8 of 67)

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

New Equipment | Printing

ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p

ASM Assembly Systems (DEK)

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

Solder Paste Stencil Frames

New Equipment | Solder Paste Stencils

Stentech's frame-manufacturing department can make any shape and size according to our customers' needs. Frames can be made of aluminium, steel, plastic and most any kind of material. Frames can be cast, formed, welded, screwed, and/or bolted togethe

Stentech

Electroformed SMT Stencils

Electroformed SMT Stencils

New Equipment | Solder Paste Stencils

Stentech is at the forefront of the next generation of stencils, Electroformed Stencils, with more than ten years of research and development. Stentech has now been manufacturing quality Electroformed Stencils for over five years for our North Americ

Stentech

SPA 1000 Solder Paste Analyzer

SPA 1000 Solder Paste Analyzer

New Equipment | Solder Materials

SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.

Ascentech LLC

Step & Relief Stencils

Step & Relief Stencils

New Equipment | Solder Paste Stencils

Through the increase of mixed technologies, stepped stencils have gained importance to the electronic assembly manufacturer. If the solder paste quantity can no longer be adequately regulated by adjusting Step/Relief Stencil Picture the pad sizes, st

Fine Line Stencil, Inc.

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

Laser Cut Wafer Bump Stencils

Laser Cut Wafer Bump Stencils

New Equipment | Solder Paste Stencils

Laser cut stainless steel stencil for solder paste printing on wafer. Wafer bumping stencils are characterized by a high number of apertures which lie close together in the size of 90µm x 110µm. A package density of up to 250000 openings is not unus

LaserJob

Agilent Medalist SP50 Series 3 - SPI

Agilent Medalist SP50 Series 3 - SPI

New Equipment | Inspection

Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th

Agilent Technologies, Inc.


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