New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
New Equipment | Assembly Services
Air bearings for ultra-smooth motion All axes are fully preloaded Dual linear-motor-driven lower axis Travel to 1 m x 1 m Options include Z axis, vibration isolation, machine base and control enclosure The ABG10000 air-bearing gant
A Unique New Tool That Reveals the Distribution and Magnitude of Pressure Between Contacting Surfaces Simply place Pressurex� film between any two surfaces that will touch, mate or impact. It immediately reveals the pressure distribution profile that
6 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal
New Equipment | Test Equipment
The Micro Scratch Tester is widely used to characterize adhesion failure of thin films and coatings, with a typical thickness below 5 µm. The MST is also used in the analysis of organic and inorganic; soft and hard coatings. Applications include thin
RollPruf tri-polymer blend of neoprene, nitrile and natural rubber in 8 mil, hand specific design provides optimum comfort, reduced hand fatigue, with durability and strength uncommon to latex gloves. Applications: Chip Assembly Photomask Assembly Ph
Our LCDs are manufactured using COG (Chip On Glass), COB (Chip On Board), TAB (Tape Array Bonding) and COF (Chip On Flex) technology. From small graphic units suitable for cell phones to character modules for industrial use to larger TFTs (Thin Film