New SMT Equipment: thin laminates (Page 1 of 2)

EMI/RFI Shielding Laminates

EMI/RFI Shielding Laminates

New Equipment | Materials

To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)

ORION Industries

FISCHER SR-SCOPE®

FISCHER SR-SCOPE®

New Equipment | Test Equipment

Measurement of copper thickness on printed circuit boards. Non-destructive, fast, accurate, and without influence from opposing copper layers. The SR-SCOPE®‚ coating thickness gauge measures the thickness of copper coatings on the top side of pc-bo

Fischer Technology, Inc.

HYBRID/MCM DESIGNER

HYBRID/MCM DESIGNER

New Equipment |  

This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal

CAD Design Software

Thin Core Copper Clad Laminate FR4 & Prepreg

Thin Core Copper Clad Laminate FR4 & Prepreg

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

MicroThin� - Ultrathin Foils for Fine Lines/Spaces

MicroThin� - Ultrathin Foils for Fine Lines/Spaces

New Equipment |  

Designers and fabricators are always arguing about how to reduce track width and increase reliability of the circuitry. One effective solution is MicroThin�. MicroThin� is a very low profile copper 3�m or 5�m copper foil with an 18�m or 35�m peelable

Oak Mitsui Inc.

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

New Equipment | Materials

500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo

Integral Technology, Inc

2929 Bondply - Advanced Circuit Laminate

2929 Bondply - Advanced Circuit Laminate

New Equipment | Materials

2929 bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions.  A low dielectric constant (2.9) and loss tangent ( 2929 bondply is compatible with tradit

Rogers Corporation

Qualitek Electronics (M) Sdn Bhd

New Equipment |  

Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa

Qualitek Electronics (M) Sdn Bhd

Stamped Circuit Boards (SCB)

Stamped Circuit Boards (SCB)

New Equipment | Materials

As requirements are increasing, so are electronic systems becoming smaller and smaller and more complex. In its role as innovative forerunner Heraeus, the precious metals and technology company, has reacted to precisely this continuing trend towards

Heraeus

Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier

Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier

New Equipment | Fabrication Services

Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier Quick Details: FR4 base material 1.6mm board thickness 2oz heavy copper Plating gold finishing RF custom PCB boards Used for Radio Frequency From China PCB manufacturer Specifications

Agile Circuit Co., Ltd

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